LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE
In this layered bonding material 10, the coefficient of thermal expansion of a substrate 11 is 5.5-15.5 ppm/K, and a first surface and a second surface are coated with lead-free solder 12a, 12b. Dans ce matériau de liaison en couches 10, le coefficient de dilatation thermique d'un substrat 11 v...
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Main Authors | , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
30.09.2021
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Subjects | |
Online Access | Get full text |
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Summary: | In this layered bonding material 10, the coefficient of thermal expansion of a substrate 11 is 5.5-15.5 ppm/K, and a first surface and a second surface are coated with lead-free solder 12a, 12b.
Dans ce matériau de liaison en couches 10, le coefficient de dilatation thermique d'un substrat 11 vaut de 5,5 à 15,5 ppm/K, et une première surface et une seconde surface sont revêtues de brasure sans plomb 12a, 12b.
積層接合材料10は、基材11の線膨張係数が5.5~15.5ppm/Kであり、第1面および第2面が鉛フリーはんだ12a、12bでコーティングされている。 |
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Bibliography: | Application Number: WO2021JP11341 |