PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING WIRING BOARD

A photosensitive resin composition comprising a binder polymer, a photo-polymerizable compound, a photoinitiator, and an anthracene-based sensitizer, wherein the binder polymer contains a polymer (a) which has a hydroxy alkyl (meth)acrylate unit and a styrene or styrene derivative unit and in which...

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Bibliographic Details
Main Authors YAMASHITA Tetsuro, HIRAYAMA Yuya, SUNOHARA Seiji
Format Patent
LanguageEnglish
French
Japanese
Published 30.09.2021
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A photosensitive resin composition comprising a binder polymer, a photo-polymerizable compound, a photoinitiator, and an anthracene-based sensitizer, wherein the binder polymer contains a polymer (a) which has a hydroxy alkyl (meth)acrylate unit and a styrene or styrene derivative unit and in which the contained amount of the styrene or styrene derivative unit is 40 mass% or more. L'invention concerne une composition de résine photosensible comprenant un polymère liant, un composé photopolymérisable, un photo-initiateur et un sensibilisateur à base d'anthracène, le polymère liant contenant un polymère (a) qui a une unité d'hydroxy alkyle (méth)acrylate et une unité de styrène ou de dérivé de styrène et dans laquelle la quantité contenue de l'unité de styrène ou de dérivé de styrène est de 40 % en masse ou plus. バインダーポリマーと、光重合性化合物と、光重合開始剤と、アントラセン系増感剤と、を含有し、バインダーポリマーが、ヒドロキシアルキル（メタ）アクリレート単位及びスチレン又はスチレン誘導体単位を有し、且つ、スチレン又はスチレン誘導体単位の含有量が４０質量％以上であるポリマー（ａ）を含む、感光性樹脂組成物。
Bibliography:Application Number: WO2020JP13106