CARRIER FILM FOR SEMICONDUCTOR WAFER PROCESSING

A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G') of less than or equal to 400 kPa at 25°C, and a first polyolefin elastomer. The core layer includes a second polyolefin...

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Bibliographic Details
Main Authors RAY, Carl Douglas, SSUBRAMANIAM, Surya, BRADY, Kevin A
Format Patent
LanguageEnglish
French
Published 10.09.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SEMICONDUCTOR DEVICES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G') of less than or equal to 400 kPa at 25°C, and a first polyolefin elastomer. The core layer includes a second polyolefin elastomer, and the release layer includes a polyolefin. La présente invention concerne un film de support qui comprend une couche adhésive, une couche centrale et une couche de libération. La couche adhésive comprend un copolymère séquencé de styrène hydrogéné ayant un module de stockage (G') inférieur ou égal à 400 kPa à 25 °C, et un premier élastomère de polyoléfine. La couche centrale comprend un second élastomère de polyoléfine et la couche de libération comprend une polyoléfine.
Bibliography:Application Number: WO2021US20877