POLISHING METHOD, MECHANICAL DEVICE MANUFACTURING METHOD, AND MECHANICAL DEVICE
One embodiment of the present invention pertains to a polishing method, comprising generating fullerene aggregation grains by sliding a sliding portion of a mechanical device in a state where a polishing agent composition including fullerene and a solvent therefor is added to the sliding portion, an...
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Main Authors | , |
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Format | Patent |
Language | English French Japanese |
Published |
24.06.2021
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Subjects | |
Online Access | Get full text |
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Summary: | One embodiment of the present invention pertains to a polishing method, comprising generating fullerene aggregation grains by sliding a sliding portion of a mechanical device in a state where a polishing agent composition including fullerene and a solvent therefor is added to the sliding portion, and polishing the sliding portion.
Un mode de réalisation de la présente invention concerne un procédé de polissage, comprenant la génération de grains d'agrégation de fullerène par coulissement d'une partie coulissante d'un dispositif mécanique dans un état dans lequel une composition d'agent de polissage comprenant du fullerène et un solvant associé est ajoutée à la partie coulissante, et le polissage de la partie coulissante.
本発明の一態様は、研磨方法において、フラーレン及びその溶媒を含む研磨剤組成物を、摺動部を有する機械装置の前記摺動部に付加した状態で、前記摺動部を摺動させることによりフラーレン凝集粒を生成させ、前記摺動部を研磨する。 |
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Bibliography: | Application Number: WO2020JP17953 |