RESIN COMPOSITION FOR SEALING, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

• Main Authors: YAMAURA, Masashi, KASUGA, Keiichi, SAITO, Takahiro, KODAMA, Shunsuke, IKEDA, Tomohiro
• Format: Patent
• Language: English; French; Japanese
• Published: 10.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided is a resin composition for sealing which contains: an epoxy resin; a curing agent containing an active ester compound; and a copolymer of a C5-30 α-olefin and maleic anhydride. L'invention concerne une composition de résine pour scellement qui contient : une résine époxyde ; un agent de durcissement contenant un composé ester actif ; et un copolymère d'une α-oléfine en C5-30 et d'anhydride maléique. エポキシ樹脂と、活性エステル化合物を含む硬化剤と、炭素数５～３０のα－オレフィンと無水マレイン酸との共重合物と、を含有する封止用樹脂組成物。