CARRIER FOIL-ATTACHED METAL FOIL, MANUFACTURING METHOD THEREFOR, AND LAMINATE COMPRISING SAME

• Main Authors: CHUNG, Bo Mook, JEON, Hyun Woo, CHUN, Sung Wook
• Format: Patent
• Language: English; French; Korean
• Published: 03.06.2021
• Subjects: APPARATUS THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method for manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, such that a defect rate can be minimized. La présente invention concerne une feuille métallique fixée à une feuille de support comprenant une couche de détachable ayant une composition et une structure spécifiques, un procédé de fabrication de la feuille métallique fixée à une feuille de support, et un stratifié pour former une carte de circuit imprimé comprenant la feuille métallique fixée à une feuille de support. Le stratifié pour former une carte de circuit imprimé selon la présente invention comprend la feuille métallique fixée à une feuille de support, de telle sorte qu'un taux de défauts peut être réduit au minimum. 본 발명은 특정 조성 및 구조를 갖는 이형층을 포함하는 캐리어박 부착 금속박, 상기 캐리어박 부착 금속박의 제조방법 및 상기 캐리어박 부착 금속박을 포함하는 프린트 배선판 형성용 적층체에 관한 것이다. 본 발명에 따른 프린트 배선판 형성용 적층체는 상기 캐리어박 부착 금속박을 포함함에 따라 불량 발생율이 최소화될 수 있다.