CURING COMPOSITION FOR HIGH HEAT ADHESIVE EPOXY RESIN

• Main Authors: VERGHESE, Nikhil K. E, FISHER, Scott Michael, AGRAWAL, Mukesh
• Format: Patent
• Language: English; French
• Published: 20.05.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

An adhesive composition comprising 100 parts by weight of an epoxy resin composition; 30- 400 pbw of a curing composition comprising a monoanhydride and an aromatic dianhydride of formula (2) as provided herein; and a curing catalyst, wherein the amounts are each based on the total parts by weight o...