CURING COMPOSITION FOR HIGH HEAT ADHESIVE EPOXY RESIN

• Main Authors: VERGHESE, Nikhil K. E, FISHER, Scott Michael, AGRAWAL, Mukesh
• Format: Patent
• Language: English; French
• Published: 20.05.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

An adhesive composition comprising 100 parts by weight of an epoxy resin composition; 30- 400 pbw of a curing composition comprising a monoanhydride and an aromatic dianhydride of formula (2) as provided herein; and a curing catalyst, wherein the amounts are each based on the total parts by weight of the epoxy resin composition and the curing composition, wherein the adhesive composition after curing has a Tg of 180-260°C, wherein the adhesive composition after curing has an adhesive strength of greater than or equal to 30 MPa. L'invention concerne une composition adhésive comprenant 100 parties en poids d'une composition de résine époxy; 30 à 400 parties en poids d'une composition de durcissement comprenant un monoanhydride et un dianhydride aromatique de formule (2) tels que décrits dans la description; et un catalyseur de durcissement, les quantités étant chacune basées sur les parties totales en poids de la composition de résine époxy et de la composition de durcissement, la composition adhésive après durcissement ayant une Tg de 180 à 260 °C, la composition adhésive après durcissement ayant une force d'adhérence supérieure ou égale à 30 MPa.