BONDING SCINTILLATOR MATERIAL TO PRODUCE LARGE PANELS OR OTHER SHAPES

• Main Authors: ROCKOSI, Derrick J, HARTNETT, Thomas M, BELL, Stephanie Silberstein, GENTILMAN, Richard, WAGNER, Jeremy
• Format: Patent
• Language: English; French
• Published: 20.05.2021
• Subjects: ADHESIVES; ARTIFICIAL STONE; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; DYES; GAMMA RAY OR X-RAY MICROSCOPES; IRRADIATION DEVICES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LIME, MAGNESIA; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NUCLEAR ENGINEERING; NUCLEAR PHYSICS; PAINTS; PERFORMING OPERATIONS; PHYSICS; POLISHES; REFRACTORIES; SLAG; TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR; TRANSPORTING; TREATMENT OF NATURAL STONE

A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure. Un procédé de liaison comprend l'application d'une composition de verre sur au moins une première surface de matériau. La composition de verre comprend une poudre de verre et un solvant. La première surface de matériau est disposée sur une seconde surface de matériau. Une température élevée est appliquée à la première surface de matériau et à la seconde surface de matériau pour former une liaison entre la première surface de matériau et la seconde surface de matériau. La première surface de matériau et la seconde surface de matériau sont comprimées sous une pression isostatique.