ANTENNA MODULE AND COMMUNICATION DEVICE PROVIDED WITH SAME

This antenna module (100) is provided with: an antenna substrate (30) including power supply elements (121); and a RFIC (110) mounted to the bottom surface (30b) of the antenna substrate (30). The antenna substrate (30) has a protruding part (A1) protruding further outward than a mounting part (A0)...

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Bibliographic Details
Main Authors GOUCHI, Naoki, ONAKA, Kengo
Format Patent
LanguageEnglish
French
Japanese
Published 01.04.2021
Subjects
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Summary:This antenna module (100) is provided with: an antenna substrate (30) including power supply elements (121); and a RFIC (110) mounted to the bottom surface (30b) of the antenna substrate (30). The antenna substrate (30) has a protruding part (A1) protruding further outward than a mounting part (A0) to which the RFIC (110) is mounted. The power supply elements (121) are arranged in the mounting part (AO) and in the protruding part (A1). The antenna module (100) is additionally provided with a heat dissipation member (70) arranged on the bottom surface (30b) in the protruding part (A1). L'invention concerne un module d'antenne (100) comprenant : un substrat d'antenne (30) comprenant des éléments d'alimentation électrique (121) ; et un RFIC (110) monté sur la surface inférieure (30b) du substrat d'antenne (30). Le substrat d'antenne (30) a une partie en saillie (A1) faisant saillie plus loin vers l'extérieur qu'une partie de montage (A0) à laquelle est monté le RFIC (110). Les éléments d'alimentation électrique (121) sont disposés dans la partie de montage (AO) et dans la partie en saillie (A1). Le module d'antenne (100) comporte en outre un élément de dissipation de chaleur (70) disposé sur la surface inférieure (30b) dans la partie en saillie (A1). アンテナモジュール(100)は、給電素子(121)を有するアンテナ基板(30)と、アンテナ基板(30)の下面(30b)に実装されるRFIC(110)とを備える。アンテナ基板(30)は、RFIC(110)が実装される実装部分(A0)よりも外側に張り出す張り出し部分(A1)を有する。給電素子(121)は、実装部分(A0)および張り出し部分(A1)に配置される。アンテナモジュール(100)は、張り出し部分(A1)における下面(30b)に配置される放熱部材(70)をさらに備える。
Bibliography:Application Number: WO2020JP26834