COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS
An atomic layer deposition method for depositing a non-conformal silicon and oxygen containing film into surface features comprising vias and/or trenches on one or more substrates. L'invention concerne un procédé de dépôt de couche atomique permettant de déposer un film contenant du silicium et...
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Main Authors | , , |
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Format | Patent |
Language | English French |
Published |
18.03.2021
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Subjects | |
Online Access | Get full text |
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