METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET

A collet according to the present disclosure, which is used for clamping an adhesive piece-attached chip obtained through a process of individualizing a wafer, comprises: a body part that has a first pressing surface to which a pressing force from a crimping device is directly transmitted; and a pro...

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Bibliographic Details
Main Authors TAZAWA Tsuyoshi, OZAKI Yoshinobu, TAIRA Ayako, ITAGAKI Kei
Format Patent
LanguageEnglish
French
Japanese
Published 11.03.2021
Subjects
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