METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET

• Main Authors: TAZAWA Tsuyoshi, OZAKI Yoshinobu, TAIRA Ayako, ITAGAKI Kei
• Format: Patent
• Language: English; French; Japanese
• Published: 11.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A collet according to the present disclosure, which is used for clamping an adhesive piece-attached chip obtained through a process of individualizing a wafer, comprises: a body part that has a first pressing surface to which a pressing force from a crimping device is directly transmitted; and a pro...