METHOD AND APPARATUS FOR FORMING HOLES IN BRITTLE MATERIALS ASSISTED BY STRESS REDUCTION THROUGH HEATING
A method of making a brittle substrate comprising the steps of: (i)heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500 oC, but below 1500 oC, to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of th...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
04.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A method of making a brittle substrate comprising the steps of: (i)heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500 oC, but below 1500 oC, to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of the brittle substrate with a laser beam emitted from an IR laser to form at least one hole in the brittle substrate.
L'invention concerne un procédé de fabrication d'un substrat fragile, comprenant les étapes consistant : (i) à chauffer au moins une partie du substrat au moins à la profondeur d jusqu'à une température Tp qui est supérieure à 500 oC, mais inférieure à 1500 oC, en vue de former une zone chauffée du substrat ; et (ii) à exposer au moins une partie de la zone chauffée du substrat fragile avec un faisceau laser émis par un laser IR en vue de former au moins un trou dans le substrat fragile. |
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Bibliography: | Application Number: WO2020US48567 |