LOW-TEMPERATURE CURABLE NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION

• Main Authors: CHANG, Yung-Cheng, NOYA, Atsuko, LIN, Cho-Ying, YOKOYAMA, Daishi
• Format: Patent
• Language: English; French
• Published: 28.01.2021
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide a negative type photosensitive composition having excellent chemical resistance and capable of being cured at a low temperature. A negative type photosensitive composition comprising (I) a polysiloxane having a specific structure, (II) a polymerization initiator, (III) a compound containing two or more (meth)acryloyloxy groups, and (IV) a solvent. Pour fournir une composition photosensible de type négatif ayant une excellente résistance chimique et apte à être durcie à basse température. L'invention concerne une composition photosensible de type négatif comprenant (I) un polysiloxane ayant une structure spécifique, (II) un initiateur de polymérisation, (III) un composé contenant deux groupes (méth)acryloyloxy ou plus, et (IV) un solvant.