CAMERA MODULE, CIRCUIT BOARD ASSEMBLY AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE

• Main Authors: MEI, Qimin, XI, Fengsheng, MEI, Zhewen, HUANG, Zhen, LUAN, Zhongyu
• Format: Patent
• Language: Chinese; English; French
• Published: 25.03.2021
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION

Provided in the present invention are a camera module, a circuit board assembly and a fabrication method therefor, and an electronic device, the circuit board assembly comprising: a substrate, a photosensitive component, and at least one molded base. The photosensitive component is electrically connected to the substrate, wherein the photosensitive component is integrally fixed to the substrate by the molded base; the molded base comprises a base inner wall and a base outer wall, and further has a molded upper surface and a molded lower surface, wherein the base inner wall forms a light window of the molded base, and the base inner wall further has an inner oblique surface and an inner arc surface; the inner arc surface extends to an inner side surface, and the inner arc surface faces the molded base. La présente invention concerne un module de caméra, un ensemble carte de circuit imprimé et son procédé de fabrication, et un dispositif électronique, l'ensemble carte de circuit imprimé comprenant : un substrat