PRINTED CIRCUIT BOARD

• Main Authors: KIM, Jae Hwa, SHIN, Seung Yul, RYU, Sung Wuk
• Format: Patent
• Language: English; French; Korean
• Published: 10.12.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A printed circuit board according to an embodiment comprises: a first insulation layer; a second insulation layer disposed on the first insulation layer; and a cavity formed in the first and second insulation layers, wherein the cavity includes a first part formed in the second insulation layer and a second part formed in the first insulation layer, and the first part has a first cross-sectional shape and the second part has a second cross-sectional shape that is different from the first cross-sectional shape. Une carte de circuit imprimé selon un mode de réalisation comprend: une première couche d'isolation; une seconde couche d'isolation disposée sur la première couche d'isolation; et une cavité formée dans les première et seconde couches d'isolation, la cavité comprenant une première partie formée dans la seconde couche d'isolation et une seconde partie formée dans la première couche d'isolation, et la première partie a une première forme en coupe transversale et la seconde partie a une seconde forme en coupe transversale qui est différente de la première forme en coupe transversale. 실시 예에 따른 인쇄회로기판은 제1 절연층; 상기 제1 절연층 상에 배치된 제2 절연층; 및 상기 제1 및 제2 절연층에 형성된 캐비티를 포함하고, 상기 캐비티는, 상기 제2 절연층에 형성된 제1 부분; 및 상기 제1 절연층에 형성된 제2 부분을 포함하고, 상기 제1 부분은, 제1 단면 형상을 가지고, 상기 제2 부분은, 상기 제1 단면 형상과 다른 제2 단면 형상을 가진다.