SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD
A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English French Japanese |
Published |
10.12.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of the roughened surface is 1.0-8.5 μm inclusive, and the root mean square height Sq is 0.10-0.98 μm inclusive.
L'invention concerne une feuille de cuivre traitée en surface présentant des propriétés de traitement de circuits haute qualité et une adhérence exceptionnelle à un substrat de résine. Une feuille de cuivre traitée en surface ayant, sur sa surface, une surface rugueuse formée par un procédé de rugosification, la longueur d'autocorrélation minimale Sal de la surface rugueuse étant comprise entre 1,0 et 8,5 µm inclus, et la hauteur moyenne quadratique Sq étant comprise entre 0,10 et 0,98 µm inclus.
微細配線加工性を有し、且つ、樹脂製基板との密着性に優れる表面処理銅箔を提供する。粗化処理による粗化面を表面に有する表面処理銅箔であって、粗化面の最小自己相関長さSalが1.0μm以上8.5μm以下であり、二乗平均平方根高さSqが0.10μm以上0.98μm以下である。 |
---|---|
Bibliography: | Application Number: WO2020JP21782 |