PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

• Main Authors: NOMOTO, Shuji, OKADE, Shota, SUZUKI, Yoshikazu, NAKAMURA, Akihiro, TAKASE, Yuji, SAWAMOTO, Hayato
• Format: Patent
• Language: English; French; Japanese
• Published: 03.12.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to: a photosensitive resin composition which contains (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and (B) a photopolymerization initiator, wherein at least one component among the components contained in the photosensitive resin composition contains a dicyclopentadiene skeleton; a photosensitive resin film which uses this photosensitive resin composition; a printed wiring board; a method for producing the printed wiring board; and a semiconductor package. La présente invention concerne une composition de résine photosensible qui contient (A) un composé photopolymérisable ayant un groupe à insaturation éthylénique et un substituant acide et (B) un amorceur de photopolymérisation, au moins un constituant, parmi les constituants contenus dans la composition de résine photosensible, contenant un squelette dicyclopentadiène ; un film de résine photosensible utilisant cette composition de résine photosensible ; un circuit imprimé ; un procédé de production du circuit imprimé ; et un boîtier de semi-conducteur. （Ａ）エチレン性不飽和基及び酸性置換基を有する光重合性化合物、及び（Ｂ）光重合開始剤、を含有する感光性樹脂組成物であって、該感光性樹脂組成物に含有される成分のうち、少なくとも１種がジシクロペンタジエン骨格を含む成分である、感光性樹脂組成物、該感光性樹脂組成物を用いた感光性樹脂フィルム、プリント配線板及びその製造方法、並びに半導体パッケージに関する。