CHEMICAL SOLUTION AND METHOD FOR TREATING OBJECT TO BE TREATED

• Main Authors: SUGISHIMA Yasuo, TAKAHASHI Tomonori
• Format: Patent
• Language: English; French; Japanese
• Published: 01.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

The present invention provides a chemical solution, wherein when the chemical solution is applied to an object to be treated containing a first metal-containing substance, the variation in the dissolved amount of the first metal-containing substance is small. Also, provided is a method for treating an object to be treated. A chemical solution according to the present invention contains: water; a hydroxylamine compound selected from the group consisting of hydroxylamine and a hydroxylamine salt; and a specific compound represented by formula (1). La présente invention concerne une solution chimique avec laquelle, lorsque ladite soluti on chimique est appliquée à un objet à traiter contenant une première substance métallique, la variation de la quantité dissoute de la première substance métallique est faible. L'invention concerne également un procédé de traitement d'un objet à traiter. Une solution chimique selon la présente invention contient : de l'eau ; un composé d'hydroxylamine choisi dans le groupe constitué par l'hydroxylamine et un sel d'hydroxylamine ; et un composé spécifique représenté par la formule (1). 本発明は、第１金属含有物を含有する被処理物に適用した際に、第１金属含有物の溶解量のバラツキが小さい薬液を提供する。また、被処理物の処理方法も提供する。本発明の薬液は、水と、ヒドロキシルアミン、及び、ヒドロキシルアミン塩からなる群より選ばれるヒドロキシルアミン化合物と、式（１）で表される特定化合物を含有する。