SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME

• Main Authors: HATAZAKI Akitsugu, KATO Atsushi
• Format: Patent
• Language: English; French; Japanese
• Published: 24.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The semiconductor device according to an embodiment of the present invention includes: a first chip that has a first semiconductor substrate, a first semiconductor element provided on the first semiconductor substrate, a first wiring layer connected to the first semiconductor element, and a first pa...