WAFER LAPPING APPARATUS
The present invention provides a wafer lapping apparatus comprising: a top lap; a plurality of through holes perforated in the top lap; a plurality of supply tubes respectively coupled to the plurality of through holes, to supply slurry or air to under the top lap; and a backflow prevention unit pro...
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Main Author | |
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Format | Patent |
Language | English French Korean |
Published |
17.09.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a wafer lapping apparatus comprising: a top lap; a plurality of through holes perforated in the top lap; a plurality of supply tubes respectively coupled to the plurality of through holes, to supply slurry or air to under the top lap; and a backflow prevention unit provided in the supply tubes, to prevent the slurry under the top lap from backflowing.
La présente invention concerne un appareil de rodage de tranche comprenant : une nappe supérieure; une pluralité de trous traversants perforés dans la nappe supérieure; une pluralité de tubes d'alimentation respectivement couplés à la pluralité de trous traversants, pour amener de la pâte ou de l'air sous la nappe supérieure; et une unité de prévention de reflux disposée dans les tubes d'alimentation, pour empêcher la pâte sous la nappe supérieure de refluer.
본 발명은 상정반; 상기 상정반에 관통 형성된 다수의 관통홀; 상기 다수의 관통홀에 각각 결합되어 슬러리 또는 공기를 상기 상정반 아래로 공급하는 다수의 공급관; 및 상기 공급관에 구비되어 상기 상정반 아래의 슬러리가 역류하는 것을 방지하는 역류방지부; 를 포함하는 웨이퍼 랩핑 장치를 제공한다. |
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Bibliography: | Application Number: WO2019KR03418 |