CURABLE COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

One aspect of the present invention is a curable composition containing a compound represented by formula (1) and a polymerization initiator. In formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain...

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Bibliographic Details
Main Authors MORIMOTO Tsuyoshi, YOKOTA Hiroshi, SANO Atsuko, FURUKAWA Naoki
Format Patent
LanguageEnglish
French
Japanese
Published 17.09.2020
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Summary:One aspect of the present invention is a curable composition containing a compound represented by formula (1) and a polymerization initiator. In formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain. Un aspect de l'invention concerne une composition durcissable contenant un composé représenté par la formule générale (1), et un initiateur de polymérisation. Dans la formule (1), R11 et R12 représentent indépendamment un atome d'hydrogène ou un groupe méthyle, et R13 représente un groupe divalent possédant une chaîne polyoxyalkylène. 本発明の一側面は、下記式(1)で表される化合物と、重合開始剤と、を含有する硬化性組成物である。 式(1)中、R11及びR12はそれぞれ独立に水素原子又はメチル基を表し、R13はポリオキシアルキレン鎖を有する2価の基を表す。
Bibliography:Application Number: WO2019JP10596