NIP FORMATION MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS

A nip formation member includes a base, a high thermal conduction member, and a securing member. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The securing member is independent from the base and the high thermal conduction member. The...

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Bibliographic Details
Main Authors FUJIWARA Hitoshi, IWAYA Naoki
Format Patent
LanguageEnglish
French
Published 10.09.2020
Subjects
CINEMATOGRAPHY
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
HOLOGRAPHY
MAGNETOGRAPHY
PHOTOGRAPHY
PHYSICS
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Summary:A nip formation member includes a base, a high thermal conduction member, and a securing member. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The securing member is independent from the base and the high thermal conduction member. The securing member is configured to restrict movement of the base relative to the high thermal conduction member. La présente invention concerne un élément de formation de pincement qui comprend une base, un élément à conduction thermique élevée et un élément de fixation. L'élément à conductivité thermique élevée possède une conductivité thermique supérieure à la conductivité thermique de la base. L'élément de fixation est indépendant de la base et de l'élément à conduction thermique élevée. L'élément de fixation est conçu pour limiter le mouvement de la base par rapport à l'élément à conduction thermique élevée.
Bibliography:Application Number: WO2020JP06409