SILVER PLATING SOLUTION COMPOSITION

• Main Authors: MOTOZAKI Toru, TOKUHISA Tomoaki
• Format: Patent
• Language: English; French; Japanese
• Published: 27.08.2020
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided is a novel silver plating solution composition containing: (A) a water-soluble thiosulfate compound; (B) a silver ion source; and (C) water. L'invention concerne une nouvelle composition de solution de placage d'argent contenant : (A) un composé thiosulfate hydrosoluble ; (B) une source d'ions argent ; et (C) de l'eau. （Ａ）水溶性チオ硫酸化合物、（Ｂ）銀イオン源および（Ｃ）水を含有する、新規な銀めっき液組成物を提供する。