SPUTTERING FILM FORMING APPARATUS, SPUTTERING FILM FORMING METHOD THEREFOR, AND COMPOUND THIN FILM

• Main Authors: NAGAE, Ekishu, SUGAWARA, Takuya, INASE, Yosuke
• Format: Patent
• Language: English; French; Japanese
• Published: 27.08.2020
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present application discloses a sputtering film forming apparatus comprising: a vacuum container having an exhaust mechanism; a substrate holding means capable of holding a plurality of substrates; and a sputtering area and a reaction area located inside the vacuum container and spatially separa...