APPARATUS FOR PROCESSING A WAFER, AND METHOD OF CONTROLLING SUCH AN APPARATUS

• Main Authors: KLEINDIENST, Martin, KOCH, Stefan
• Format: Patent
• Language: English; French
• Published: 13.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus for processing a wafer comprises: a rotatable chuck adapted to receive a wafer; a heating assembly comprising an array of heating elements arranged to heat a wafer received by the rotatable chuck; an image sensor arranged to detect electromagnetic radiation from a surface of the wafer;...