RESIN COMPOSITION FOR SEALING, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

• Main Authors: YAMAURA, Masashi, SAITO, Takahiro, TANAKA, Mika, KODAMA, Shunsuke, BABA, Toru
• Format: Patent
• Language: English; French; Japanese
• Published: 06.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A resin composition for sealing, which contains: an epoxy resin; a curing agent that contains an active ester compound; and a thermosetting silicone. L'invention concerne une composition de résine pour scellement, qui contient : une résine époxy ; un agent de durcissement qui contient un composé ester actif ; et une silicone thermodurcissable. エポキシ樹脂と、活性エステル化合物を含む硬化剤と、熱硬化性シリコーンとを含有する封止用樹脂組成物。