POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND

[Problem] To provide a polyimide compound having high heat resistance and transparency. [Solution] The polyimide compound of the present invention is characterized by being the reaction product of a diamine compound represented by general formula (1) and an alicyclic tetracarboxylic dianhydride repr...

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Bibliographic Details
Main Authors GOSHIMA Toshiyuki, WIN Maw Soe
Format Patent
LanguageEnglish
French
Japanese
Published 06.08.2020
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Summary:[Problem] To provide a polyimide compound having high heat resistance and transparency. [Solution] The polyimide compound of the present invention is characterized by being the reaction product of a diamine compound represented by general formula (1) and an alicyclic tetracarboxylic dianhydride represented by general formula (2). L'invention vise à fournir un composé polyimide ayant une résistance à la chaleur et une transparence élevées. A cet effet, le composé polyimide de la présente invention est caractérisé en ce qu'il est le produit de la réaction d'un composé diamine représenté par la formule générale (1) et d'un dianhydride tétracarboxylique alicyclique représenté par la formule générale (2). [課題]高い耐熱性及び透明性を有する、ポリイミド化合物の提供。 [解決手段]本発明のポリイミド化合物は、下記一般式(1)で表されるジアミン化合物と、下記一般式(2)で表される脂環式テトラカルボン酸二無水物との反応物であることを特徴とする。
Bibliography:Application Number: WO2019JP03595