MICROSTRUCTURED GLASS SUBSTRATE AND METHOD FOR MANUFACTURING MICROSTRUCTURED GLASS SUBSTRATE

• Main Authors: MIYAUCHI Taro, FUJIMOTO Shingo, YAMADA Masayoshi, INOUE Teruhide
• Format: Patent
• Language: English; French; Japanese
• Published: 23.07.2020
• Subjects: CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; METALLURGY; MINERAL OR SLAG WOOL; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS

A microstructured glass substrate (10) has a thickness of 50-2000 μm, is opened in a first main surface (11) and has a hole which, when the microstructured glass substrate (10) is referred to as t, satisfies the following requirements: (i) 0.4≤ΦC/ΦA≤1.0; (ii) 70°≤θ≤90°; (iii)Ra≤1.0 μm; (iv) 0≤D/t≤0.003; and (v) 1.5≤L/ΦC≤30. L'invention concerne un substrat de verre microstructuré (10) ayant une épaisseur de 50 à 2 000 µm, qui est ouvert dans une première surface principale (11) et a un trou qui, lorsque le substrat de verre microstructuré (10) est appelé t, satisfait les exigences suivantes : (i) 0,4 ≤ ΦC/ΦA ≤ 1,0 ; (ii) 70° ≤ θ ≤ 90° ; (iii)Ra ≤ 1,0 μm ; (iv) 0 ≤ D/t ≤ 0,003 ; et (v) 1,5 ≤ L/ΦC ≤ 30. 微細構造付ガラス基板（１０）は、５０μｍ～２０００μｍの厚みを有し、第一主面（１１）において開口しているとともに、微細構造付ガラス基板（１０）をｔと表すとき、（ｉ）０．４≦ΦC／ΦA≦１．０、（ii）７０°≦θ≦９０°、（iii）Ｒａ≦１．０μｍ、（iv）０≦Ｄ／ｔ≦０．００３、及び（ｖ）１．５≦Ｌ／ΦC≦３０の条件を満たす孔を有する。