FLIP CHIP LASER BONDING SYSTEM

• Main Author: AHN, Geun Sik
• Format: Patent
• Language: English; French; Korean
• Published: 09.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a flip chip laser bonding system and a flip chip laser bonding system and, more specifically, to a flip chip laser bonding system for bonding a semiconductor chip in a flip chip form to a substrate by using a laser beam. The flip chip laser bonding system according to the present invention may bond even a semiconductor chip that is bent or is likely to bend to a substrate without contact failure of solder bumps by laser bonding the semiconductor chip to the substrate while pressurizing the semiconductor chip. La présente invention concerne un système de soudage laser de puce retournée et un système de soudage laser de puce retournée et, plus spécifiquement, un système de soudage laser de puce retournée destiné à souder une puce semi-conductrice selon une forme de puce retournée à un substrat à l'aide d'un faisceau laser. Le système de soudage laser de puce retournée selon la présente invention peut souder même une puce semi-conductrice qui est courbée ou qui est susceptible de se courber à un substrat sans rupture de contact de bossages de soudure par soudage laser de la puce semi-conductrice au substrat tout en mettant sous pression la puce semi-conductrice. 본 발명은 플립칩 레이저 본딩 시스템 및 플립칩 레이저 본딩 시스템에 관한 것으로서, 더욱 상세하게는 플립칩 형태의 반도체 칩을 레이저 빔을 이용하여 기판에 본딩하는 플립칩 레이저 본딩 시스템에 관한 것이다. 본 발명에 의한 플립칩 레이저 본딩 시스템은 반도체 칩을 가압한 상태로 기판에 레이저 본딩함으로써 휘어져 있거나 휘어질 수 있는 반도체 칩도 솔더 범프의 접촉 불량 없이 기판에 본딩할 수 있는 효과가 있다.