PLATED LAMINATE AND PRINTED CIRCUIT BOARD

• Main Authors: CHUNG, Bo Mook, CHUN, Sung Wook, PARK, Myong Whan
• Format: Patent
• Language: English; French; Korean
• Published: 22.05.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to a plating laminating technique for providing an inner layer of a printed circuit board having improved adhesive force, and has an effect of providing: an electrolessly plated laminate including a non-etching/low luminance laminated pre-treatment body or low luminance copper foil; and a printed circuit board comprising same. La présente invention concerne une technique de stratification par placage pour fournir une couche interne d'une carte de circuit imprimé ayant une force adhésive améliorée, et a pour effet de fournir : un stratifié à placage autocatalytique comprenant un corps de pré-traitement stratifié sans gravure/à faible luminance ou une feuille de cuivre à faible luminance ; et une carte de circuit imprimé comprenant celui-ci. 본 발명은 밀착력이 향상된 인쇄회로기판의 내층을 제공하기 위한 도금 적층 기술에 관한 것으로, 무엣칭/저조도 적층 전처리체 또는 저조도 동박을 비롯한 무전해 도금 적층체 및 이를 포함하는 인쇄회로기판을 제공하는 효과가 있다.