HEAT CONDUCTIVE SPACER FOR PLASMA PROCESSING CHAMBER

Aspects of the present disclosure relate to a heat conductive spacer for use within a lid assembly of a plasma processing chamber. In one implementation, a plasma processing chamber includes a chamber body, and a lid assembly coupled to the chamber body defining a processing volume. The lid assembly...

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Bibliographic Details
Main Authors CHOI, Soo Young, PARK, Beom Soo, ZHAO, Lai, SEQUEIRA, Jeevan Prakash, CHEN, Wei-Ting, HSU, Cheng-Hang, YANG, Hsiao-Ling, LAU, Allen K, SUNG, Won Ho, OH, Sang Jeong, FURUTA, Gaku, HONG, Hyun Young, TINER, Robin L, LI, Jianheng
Format Patent
LanguageEnglish
French
Published 02.07.2020
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