FLUX AND SOLDER PASTE

A flux which contains an organic acid, a solvent and a polyoxyethylene behenyl alcohol that has an average number of moles of added ethylene oxide of 7-40 mol. Flux qui contient un acide organique, un solvant et un alcool de polyoxyéthylène béhényl qui a un nombre moyen de moles d'oxyde d'...

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Bibliographic Details
Main Authors TAKAHASHI, Atsumi, KAWASAKI, Hiroyoshi, SHIRATORI, Masato, SHIRAKAWA, Ayaka, SUGII, Hiroshi, MARUKO, Daisuke
Format Patent
LanguageEnglish
French
Japanese
Published 30.04.2020
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:A flux which contains an organic acid, a solvent and a polyoxyethylene behenyl alcohol that has an average number of moles of added ethylene oxide of 7-40 mol. Flux qui contient un acide organique, un solvant et un alcool de polyoxyéthylène béhényl qui a un nombre moyen de moles d'oxyde d'éthylène ajouté de 7 à 40 moles. 有機酸と、溶剤と、７～４０ｍｏｌのエチレンオキサイド平均付加モル数を有するポリオキシエチレンベヘニルアルコールと、を含むフラックス。
Bibliography:Application Number: WO2019JP41397