SYSTEM AND METHOD FOR FACILITATING CHEMICAL MECHANICAL POLISHING
Described herein is a method for facilitating chemical mechanical polishing. The method comprises determining contact mechanics information indicative of contact pressures and friction forces between a wafer and a pad during the chemical mechanical polishing at a plurality of locations across the wa...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English French |
Published |
23.04.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Described herein is a method for facilitating chemical mechanical polishing. The method comprises determining contact mechanics information indicative of contact pressures and friction forces between a wafer and a pad during the chemical mechanical polishing at a plurality of locations across the wafer. The contact pressures and friction forces are asymmetrically distributed across the wafer. The method also includes determining a post chemical mechanical polishing surface topography of the wafer based at least on the contact mechanics information.
La présente invention concerne un procédé destiné à faciliter le polissage chimico-mécanique. Le procédé consiste à déterminer des informations de mécanique de contact indiquant des pressions de contact et des forces de frottement entre une tranche et un tampon pendant le polissage chimico-mécanique au niveau d'une pluralité d'emplacements à travers la tranche. Les pressions de contact et les forces de frottement sont réparties de manière asymétrique à travers la tranche. Le procédé consiste également à déterminer une topographie de surface post-polissage chimico-mécanique de la tranche en fonction au moins des informations de mécanique de contact. |
---|---|
Bibliography: | Application Number: WO2019EP76795 |