LED FILAMENT HAVING MULTIPLE BOUND SURFACES

An LED filament having multiple bound surfaces comprises an installation plate (110) having a lead (150) and a packaging colloid (120) covering the installation plate (110). The installation plate (110) at least has a first installation surface (311) and a second installation surface (312). The firs...

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Bibliographic Details
Main Author ZHOU, Zhihai
Format Patent
LanguageChinese
English
French
Published 02.01.2020
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Summary:An LED filament having multiple bound surfaces comprises an installation plate (110) having a lead (150) and a packaging colloid (120) covering the installation plate (110). The installation plate (110) at least has a first installation surface (311) and a second installation surface (312). The first installation surface (311) and the second installation surface (312) are arranged opposite to each other other, and a plurality of LED chips are respectively fixed thereto. An LED filament having the above structure can realize light emission from chips bonded to bonding lines at multiple surfaces thereof, thereby enhancing overall luminous efficiency, and effectively solving the problem in which light colors at different regions of a filament product are inconsistent. When the LED filament having the above packaging structure emits light, the entire filament can uniformly dissipate heat, thereby effectively increasing running power and reliability of filament products. L'invention concerne un filament de DEL aya
Bibliography:Application Number: WO2018CN106830