BACKLIGHT UNIT MANUFACTURING METHOD USING MINI LED

• Main Authors: KIM, Sun Gyun, JEONG, Young Hee, KIM, Gi Min, LEE, Jong Woong, CHOI, Young Woo, BANG, Hae Chang, JEONG, Ja Eil
• Format: Patent
• Language: English; French; Korean
• Published: 19.12.2019
• Subjects: DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A backlight unit manufacturing method using a mini LED is provided. A backlight unit manufacturing method using a mini LED, according to an embodiment of the present invention, comprises the steps of: printing a plurality of solders on a substrate; bonding a plurality of LED chips to upper parts of the printed solders; printing a reflective material on the substrate to which the LED chips are bonded; and protecting the LED chips by printing, nearby the LED chips, an encapsulation material including a fluorescent substance. La présente invention concerne un procédé de fabrication d'unité de rétroéclairage à l'aide d'une mini-DEL. Un procédé de fabrication d'unité de rétroéclairage utilisant une mini-DEL, selon un mode de réalisation de la présente invention, comprend les étapes consistant : à imprimer une pluralité de soudures sur un substrat; à lier une pluralité de puces de DEL à des parties supérieures des soudures imprimées; à imprimer un matériau réfléchissant sur le substrat auquel les puces de DEL sont liées; et à protéger les puces de DEL par impression, à proximité des puces de DEL, d'un matériau d'encapsulation comprenant une substance fluorescente. 미니 LED를 이용한 백라이트 유닛 제조 방법이 제공된다. 본 발명의 실시예에 따른 미니 LED를 이용한 백라이트 유닛 제조 방법은, 기판에 복수개의 솔더(solder)를 프린팅하는 단계; 상기 프린팅 된 솔더 상부에 복수개의 LED 칩을 접착하는 단계; 상기 LED 칩이 접착된 상기 기판에 반사재를 프린팅하는 단계; 및 상기 LED 칩 주변에 형광체를 포함하는 봉지재를 프린팅하여 상기 LED 칩을 보호하는 단계;를 포함한다.