CURABLE COMPOSITION, CURABLE COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE

• Main Authors: MORIMOTO Tsuyoshi, MATSUBARA Nozomi, KIZAWA Keiko, YOKOTA Hiroshi, NAGAI Akira, SANO Atsuko, FURUKAWA Naoki
• Format: Patent
• Language: English; French; Japanese
• Published: 21.11.2019
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A curable composition according to one aspect of the present invention contains: an epoxy compound; a capsule containing a heat storage component; and a curing agent. Une composition durcissable selon un aspect de la présente invention contient : un composé époxy; une capsule contenant un composant de stockage de chaleur; et un agent de durcissement. 本発明の一側面は、エポキシ化合物と、蓄熱性成分を内包したカプセルと、硬化剤と、を含有する硬化性組成物である。