METHOD FOR MANUFACTURING BOARD WITH EMBEDDED COMPONENTS, AND BOARD WITH EMBEDDED COMPONENTS

• Main Authors: AOKI, Kentaro, MATSUMOTO, Tohru, SASAKI, Tatsuya
• Format: Patent
• Language: English; French; Japanese
• Published: 17.10.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

[Problem] To improve connection reliability between electronic components and conductor layers in a board with embedded components in which a plurality of electronic components connected to different conductor layers are embedded. [Solution] The present invention provides a method for manufacturing...