MOLD RELEASE FILM

• Main Authors: ROKUSHA, Yuuki, KOYAHARA, Hiroaki, TADA, Hiroshi, MAEKAWA, Hiroaki, TOYOSHIMA, Katsunori, KAWAHARA, Ryousuke
• Format: Patent
• Language: English; French; Japanese
• Published: 26.09.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The present invention addresses the problem of providing a mold release film which has superior mold release properties compared with conventional mold release films and can be used suitably for the R-to-R-mode production of a flexible circuit board. The present invention is a mold release film having at least one mold release layer, wherein the mold release layer has a crystallinity of 50% or more as measured by a grazing incidence wide angle X-ray diffraction method employing 0.06° as an incidence angle. Le problème abordé par la présente invention est de pourvoir à un film de démoulage ayant des propriétés de démoulage supérieures comparativement à des films de démoulage classiques et qui se prête à la production en mode R-R d'une carte de circuit imprimé souple. La solution selon la présente invention porte sur un film de démoulage comportant au moins une couche de démoulage, où la couche de démoulage a une cristallinité, mesurée par un procédé de diffraction des rayons X à un large angle d'incidence rasante utilisant 0,06 ° à titre d'angle d'incidence, qui est supérieure ou égale à 50 %. 本発明は、従来よりも優れた離型性を有し、ＲｔｏＲ方式によるフレキシブル回路基板の製造にも好適に用いることができる離型フィルムを提供することを目的とする。 本発明は、少なくとも１つの離型層を有する離型フィルムであって、前記離型層は、入射角を０．０６°とした斜入射広角Ｘ線回折法により求められる結晶化度が５０％以上である離型フィルムである。