METHODS FOR CONTROLLING PHYSICAL VAPOR DEPOSITION METAL FILM ADHESION TO SUBSTRATES AND SURFACES

• Main Authors: WANG, Yifei, SRINIVASAN, Akhil
• Format: Patent
• Language: English; French
• Published: 15.08.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIAGNOSIS; DIFFUSION TREATMENT OF METALLIC MATERIAL; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MEDICAL OR VETERINARY SCIENCE; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; SURGERY

A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate. L'invention concerne un procédé de dépôt d'un film sur un substrat avec une adhérence contrôlée. Le procédé consiste à déposer le film comprenant du métal, le métal étant déposé sur le substrat à l'aide d'un dépôt physique en phase vapeur à une pression qui atteint une adhérence prédéfinie du film sur le substrat. L'adhérence prédéfinie permet le traitement du film dans un dispositif lorsque le film est collé au substrat, mais permet également le retrait du dispositif vis-à-vis du substrat.