ELECTROMAGNETIC WAVE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

• Main Authors: KANG, Hosuk, MUN, Ilju
• Format: Patent
• Language: English; French; Korean
• Published: 08.08.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad. L'invention concerne une structure de blindage contre les ondes électromagnétiques. La structure de blindage contre les ondes électromagnétiques comprend : une carte de circuit imprimé comportant une pluralité d'éléments montés en son sein et ayant une plage de masse entourant la pluralité d'éléments ; un élément d'isolation constitué d'un matériau isolant prémoulé et fixé à la carte de circuit imprimé pour entourer la pluralité d'éléments ; et une couche de revêtement conductrice recouvrant une surface extérieure de l'élément d'isolation, la couche de revêtement conductrice étant connectée à la plage de masse. 전자파 차폐구조가 개시된다. 전자파 차폐구조는, 다수의 소자가 실장되고 다수의 소자를 둘러싸는 그라운드 패드를 구비한 인쇄회로기판, 미리 성형된(pre-molded) 절연성 물질로 구성되며, 인쇄회로기판에 부착되어 다수의 소자를 감싸는 절연부재 및 절연부재의 외측면을 덮는 도전성 코팅층을 포함하고, 도전성 코팅층은 그라운드 패드와 연결된다.