LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE

A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces. L'invent...

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Bibliographic Details
Main Authors YAGODA, Jared, BEUHLER, Allyson
Format Patent
LanguageEnglish
French
Published 27.06.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces. L'invention concerne une carte à circuit imprimé. La carte à circuit imprimé comprend : une couche de substrat; une couche de cuivre disposée sur la couche de substrat ; et une couche de conservation de soudabilité organique (OSP) disposée sur la couche de cuivre. La couche OSP définit au moins une surface OSP traitée au laser.
Bibliography:Application Number: WO2018US66412