LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE
A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces. L'invent...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
27.06.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.
L'invention concerne une carte à circuit imprimé. La carte à circuit imprimé comprend : une couche de substrat; une couche de cuivre disposée sur la couche de substrat ; et une couche de conservation de soudabilité organique (OSP) disposée sur la couche de cuivre. La couche OSP définit au moins une surface OSP traitée au laser. |
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Bibliography: | Application Number: WO2018US66412 |