FINGERPRINT RECOGNITION PACKAGE AND METHOD FOR MANUFACTURING SAME

• Main Authors: LEE, Tack-Mo, LEE, Kyo-Ree, PARK, Tae-Sang, KIM, Mi-Jin, KIM, Seong-Jun
• Format: Patent
• Language: English; French; Korean
• Published: 28.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PHYSICS; SEMICONDUCTOR DEVICES

Various embodiments disclosed herein relates to a fingerprint recognition package and, according to one embodiment, the fingerprint recognition package may comprise: a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. Various other embodiments are also possible. Divers modes de réalisation de l'invention concernent un boîtier de reconnaissance d'empreintes digitales et, selon un mode de réalisation, l'ensemble de reconnaissance d'empreintes digitales peut comprendre : une carte de circuit imprimé ; une puce de capteur d'image fixée et connectée électriquement à la carte de circuit imprimé ; un élément de protection contre la lumière appliqué à la carte de circuit imprimé ; et un élément adhésif fixé à un côté de l'élément de protection contre la lumière. Divers autres modes de réalisation sont également possibles. 지문인식 패키지와 관련된 다양한 실시예들이 기술된 바, 한 실시예에 따르면, 지문인식 패키지는, 회로기판; 상기 회로 기판에 부착됨과 아울러 전기적으로 연결되는 이미지 센서 다이; 상기 회로 기판에 도포되는 차광 부재; 및 상기 차광 부재의 일면에 부착되는 접착 부재를 포함할 수 있으며, 이외에도 다양한 다른 실시예들이 가능하다.