LIGHT EMITTING DEVICE PACKAGE

• Main Authors: KIM, Ki Seok, LIM, Chang Man, SONG, June O
• Format: Patent
• Language: English; French; Korean
• Published: 21.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A light emitting device package according to an embodiment may comprise a first package body which includes first and second opening portions passing through the upper surface and lower surface; a second package body which is disposed on the first package body and includes a third opening portion passing through the upper surface and lower surface; a light emitting device which is disposed in the third opening portion; a first resin which is disposed between the upper surface of the first package body and the light emitting device; and a second resin which is disposed in the third opening portion. According to the embodiment, the top surface of the first package body is coupled to the lower surface of the second package body, the first package body includes a recess which is recessed from the upper surface of the first package body to the bottom surface of the first package body, the first resin is disposed in the recess, the first resin and the second resin comprise materials different from each other, and the first resin may be in contact with the light emitting device and the second resin. Selon un mode de réalisation, cette invention concerne un boîtier de dispositif électroluminescent, comprenant un premier corps de boîtier qui comprend des première et deuxième parties d'ouverture traversant une surface supérieure et une surface inférieure ; un second corps de boîtier qui est disposé sur le premier corps de boîtier et comprend une troisième partie d'ouverture traversant une surface supérieure et une surface inférieure ; un dispositif électroluminescent qui est disposé dans la troisième partie d'ouverture ; une première résine qui est disposée entre la surface supérieure du premier corps de boîtier et le dispositif électroluminescent ; et une seconde résine qui est disposée dans la troisième partie d'ouverture. Selon le mode de réalisation, la surface supérieure du premier corps de boîtier est reliée à la surface inférieure du second corps de boîtier, le premier corps de boîtier comprend un évidement qui est renfoncé à partir de la surface supérieure du premier corps de boîtier vers la surface inférieure du premier corps de boîtier, la première résine est disposée dans l'évidement, la première résine et la seconde résine comprennent des matériaux distincts, et la première résine peut être en contact avec le dispositif électroluminescent et la seconde résine. 실시 예에 따른 발광소자 패키지는, 상면과 하면을 관통하는 제1 및 제2 개구부를 포함하는 제1 패키지 몸체; 제1 패키지 몸체 상에 배치되고, 상면과 하면을 관통하는 제3 개구부를 포함하는 제2 패키지 몸체; 제3 개구부 내에 배치되는 발광소자; 제1 패키지 몸체의 상면과 발광소자 사이에 배치된 제1 수지; 및 제3 개구부 내에 배치되는 제2 수지; 를 포함할 수 있다. 실시 예에 의하면, 제1 패키지 몸체의 상면은 제2 패키지 몸체의 하면과 결합되고, 제1 패키지 몸체는 제1 패키지 몸체의 상면에서 제1 패키지 몸체의 하면으로 오목한 리세스를 포함하고, 제1 수지는 리세스에 배치되고, 제1 수지와 제2 수지는 서로 다른 물질을 포함하고, 제1 수지는 발광소자 및 제2 수지와 접촉될 수 있다.