RESIN COMPOSITION FOR SEALING, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

• Main Authors: INOUE, Hidetoshi, HIRAI, Tomoki
• Format: Patent
• Language: English; French; Japanese
• Published: 03.01.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

This resin composition for sealing comprises an epoxy resin, a curing agent, and a filler, wherein the epoxy resin includes a bisphenol type epoxy resin, and a 1,6-bis (glycidyloxy) naphthalene, and the proportion of the 1,6-bis (glycidyloxy) naphthalene occupied in the whole epoxy resin is 10-30 ma...