SEALING FILM

• Main Authors: SHIN, Moon Cheol, SHIN, Se Ho, YOO, Ho Joon, JEONG, Whoon, RYU, Jae Seol, RYU, Dong Hwan
• Format: Patent
• Language: English; French; Korean
• Published: 13.12.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

The present application relates to a sealing film, a method for preparing same, an organic electronic device comprising same and a method for preparing an organic electronic device using same. Provided is a sealing film which enables forming of a structure blocking moisture or oxygen from flowing into an organic electronic device from outside, effective emission of heat accumulates inside the organic electronic device, and prevention of bright spots generated on the organic electronic device. La présente invention porte sur un film d'étanchéité, son procédé de préparation, un dispositif électronique organique le comprenant et un procédé de préparation d'un dispositif électronique organique l'utilisant. L'invention concerne un film d'étanchéité qui permet la formation d'une structure bloquant l'humidité ou l'oxygène de s'écouler dans un dispositif électronique organique depuis l'extérieur, une émission efficace de chaleur qui s'accumule à l'intérieur du dispositif électronique organique, et la prévention de taches lumineuses générées sur le dispositif électronique organique. 본 출원은 봉지 필름, 이의 제조 방법, 이를 포함하는 유기전자장치 및 이를 이용한 유기전자장치의 제조 방법에 관한 것으로서, 외부로부터 유기전자장치로 유입되는 수분 또는 산소를 차단할 수 있는 구조의 형성이 가능하고, 유기전자장치의 내부에 축적되는 열을 효과적으로 방출시키며, 유기전자장치의 휘점 발생을 방지할 수 있는 봉지 필름을 제공한다.