LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE

• Main Authors: INOUE, Hidetoshi, TAKAHASHI, Hisato, KAMIMURA, Tsuyoshi, YOSHII, Haruyuki, MATSUZAKI, Takayuki
• Format: Patent
• Language: English; French; Japanese
• Published: 06.12.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A liquid resin composition for sealing that includes: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D). The inorganic filler (D) content is at least 77% by mass. La composition de résine liquide pour scellement de l'invention contient un composé époxy aliphatique (A), un composé époxy (B) possédant un cycle aromatique dans chaque molécule, un composé hétérocyclique à teneur en azote (C), et une charge inorganique (D). La teneur en charge inorganique (D) est supérieure ou égale à 77% en masse. 封止用液状樹脂組成物は、（Ａ）脂肪族エポキシ化合物、（Ｂ）分子中に芳香環を有するエポキシ化合物、（Ｃ）含窒素複素環化合物及び（Ｄ）無機充填剤を含み、前記（Ｄ）無機充填剤の含有率が、７７質量％以上である。