SEMICONDUCTOR MODULE
Provided is a semiconductor module which enables a memory bandwidth to be widened, and which enables data transfer efficiency to be improved by reducing power consumption. A semiconductor module 1 comprises: an interposer 10; and a processing unit 20 which has a plurality of processing unit bodies 2...
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Main Authors | , |
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Format | Patent |
Language | English French Japanese |
Published |
06.12.2018
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Subjects | |
Online Access | Get full text |
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