SEMICONDUCTOR MODULE

Provided is a semiconductor module which enables a memory bandwidth to be widened, and which enables data transfer efficiency to be improved by reducing power consumption. A semiconductor module 1 comprises: an interposer 10; and a processing unit 20 which has a plurality of processing unit bodies 2...

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Bibliographic Details
Main Authors ADACHI, Takao, KAJIGAYA, Kazuhiko
Format Patent
LanguageEnglish
French
Japanese
Published 06.12.2018
Subjects
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