MANUFACTURING PROCESS FOR INTEGRATED SURFACE-MOUNTED LIGHT EMITTING DEVICE

Provided is a manufacturing process for an integrated surface-mounted light emitting device (3). The process comprises the following steps: step 1, arranging and packaging several light emitting dot groups on a front surface of a substrate (1), wherein each of the light emitting dot groups comprises...

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Bibliographic Details
Main Author ZHU, Xijie
Format Patent
LanguageChinese
English
French
Published 25.10.2018
Subjects
ADVERTISING
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
PHYSICS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
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Summary:Provided is a manufacturing process for an integrated surface-mounted light emitting device (3). The process comprises the following steps: step 1, arranging and packaging several light emitting dot groups on a front surface of a substrate (1), wherein each of the light emitting dot groups comprises at least one red light emitting diode (LED) chip, at least one green LED chip, and at least one blue LED chip, and all of the LED chips are packaged on the substrate (1) by employing a chip-on-board (COB) packaging process; step 2, dividing the substrate (1) into several independent light emitting devices (3), wherein each of the light emitting devices (3) is provided with one light emitting dot group therein; step 3, turning on, at a test wavelength and luminance value, the red LED chip, green LED chip, or blue LED chip in each of the light emitting devices (3), respectively, and classifying the light emitting devices (3) according to the bin levels; and step 4, performing tests on each of the light emitting devi
Bibliography:Application Number: WO2017CN112774