RESIN COMPOSITION OBTAINED BY MIXING POLYVINYL CHLORIDE RESIN AND ACRYLIC RESIN, AND INDOOR INTERIOR MATERIAL BOARD PRODUCED USING SAME
The present invention relates to a resin composition obtained by mixing a polyvinyl chloride resin and an acrylic resin, and an indoor interior material board produced using the same. Compared to polyvinyl chloride resin used by itself, the resin composition has excellent heat resistance due to havi...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English French Korean |
Published |
27.09.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The present invention relates to a resin composition obtained by mixing a polyvinyl chloride resin and an acrylic resin, and an indoor interior material board produced using the same. Compared to polyvinyl chloride resin used by itself, the resin composition has excellent heat resistance due to having a high glass transition temperature, and has excellent processability due to having high flexibility even when a small amount of plasticizer is used. Thus, the resin composition can be used in both calendering and extrusion processes.
La présente invention concerne une composition de résine obtenue par mélange d'une résine de polychlorure de vinyle et d'une résine acrylique, et une plaque d'intérieur en matériau intérieur produite à l'aide de celle-ci. Par rapport à la résine de polychlorure de vinyle utilisée seule, la composition de résine présente une excellente résistance à la chaleur due à une température de transition vitreuse élevée, et présente une excellente aptitude au traitement due à une flexibilité élevée même lorsqu'une petite quantité de plastifiant est utilisée. Ainsi, la composition de résine peut être utilisée dans des processus de calandrage et d'extrusion.
본 발명은 폴리염화비닐 수지와 아크릴계 수지가 혼합된 수지 조성물 및 이를 이용하여 제조된 실내 내장재용 보드에 관한 것으로, 폴리염화비닐 수지를 단독 사용하는 것에 비해 유리전이온도가 높아 내열성이 우수하고, 가소제를 적게 사용하여도 유연성이 높아 가공성이 우수하여 캘린더링 방식 및 압출방식 모두에 적용될 수 있는 수지 조성물 및 이를 이용하여 제조된 실내 내장재용 보드에 관한 것이다. |
---|---|
Bibliography: | Application Number: WO2018KR02981 |